this is information on a product in full production. march 2012 doc id 022950 rev 1 1/8 8 lbp01 led bypass protection datasheet ? production data features bidirectional device: lbp01-0810b unidirectional device: LBP01-0803SC5 rohs compliant benefits keep led strings on in case of led open mode failure reduced maintenance cost increase lifetime of the lighting system complies with the following standards: iec61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-5 ? 1kv / 24 a applications this device shunts failed leds in applications where led strings can not be turned-off for safety reason due to a led failure. main applications are: automotive headlights traffic lights aircraft runaway lights emergency lighting systems display panel backlighting street lighting figure 1. functional diagrams description the lbp01 series are bypass switches to be connected in parallel with 1 or 2 leds. in case of led failure, this allows th e current to flow through the other leds. it also provides an overvoltage protection against surges defined in iec 61000-4-2 and iec 61000-4-5 their robust dice also protect leds against surge. these devices are compatible with leds up to 1a. lbp01 are packaged either in smb or sot23-5l smb (do-214aa) lbp01-0810b sot23-5l LBP01-0803SC5 control circuit control circuit 1 3 5 4 2 LBP01-0803SC5 lbp01-0810b www.st.com
characteristics lbp01 2/8 doc id 022950 rev 1 1 characteristics table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge 30 kv i pp repetitive peak pulse current (8/20s) 24 a i f on-state dc current sot23-5l 0.35 a smb 1 a t j operating junction temperature range -55 to 150 c t stg storage temperature range -65 to 150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit i rm v rm = 3 v 100 na v b o 815v i h sot23-5l 200 ma smb 200 v on i on = 0.35 a (1) sot23-5l 2 v i on = 0.35 a smb 1.3 v i on = 1 a smb 1.5 v dv/dt 300 v/s r th(j-a) on recommended pad layout with copper area of 1 cm 2 sot23-5l 140 c/w smb 100 c/w 1. measured between pin 1, 3, 4, or 5 and pin 2
lbp01 ordering information scheme doc id 022950 rev 1 3/8 2 ordering information scheme figure 4. ordering information scheme figure 2. thermal resistance, junction to ambient, versus copper area under each lead (smb) figure 3. thermal resistance, junction to ambient, versus copper area under each lead (sot23-5l) r th(j-a) (c/w) 80 100 120 140 160 180 200 0 2 0 4 06080 1 00 12 0 14 0 1 60 1 80 2 00 scu(mm 2 ) r th(j-a) (c/w) 100 120 140 160 180 200 220 240 0 20 40 60 80 100 120 140 160 180 200 scu(mm 2 ) lbp 01 - vv ii p led bypass protection version breakdown voltage forward dc current delivery mode sc5 = sot23-5l b = smb
package information lbp01 4/8 doc id 022950 rev 1 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 figure 5. footprint, dimensions in mm (inches) figure 6. marking (1) 1. product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pi n 1 mark is to be used for this purpose. e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.23) (0.064) (0.086) y w w z x x x ecopack compliance xxx: marking z: manufacturing location y: year ww: week
lbp01 package information doc id 022950 rev 1 5/8 table 4. sot23-5l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.45 0.035 0.057 a1 0 0.10 0 0.004 a2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 d 2.80 3.05 0.11 0.118 e 1.50 1.75 0.059 0.069 e0.95 0.037 h 2.60 3.00 0.102 0.118 l 0.10 0.60 0.004 0.024 m 0 10 0 10 figure 7. footprint, dimensions in mm (inches) figure 8. marking a2 a l h c b e d e e a1 q 1.10 (0.043) 0.95 (0.037) 2.30 (0.091) 3.50 (0.138) 1.20 (0.047) 0.60 (0.024) x x x x
recommendations on pcb assembly lbp01 6/8 doc id 022950 rev 1 4 recommendations on pcb assembly 4.1 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. figure 9. printed circuit board layout 4.2 reflow profile figure 10. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
lbp01 ordering information doc id 022950 rev 1 7/8 5 ordering information 6 revision history table 5. ordering information order code marking package weight base qty delivery mode LBP01-0803SC5 xt08 sot23-5l 16 mg 3000 tape and reel lbp01-0810b l08 (1) 1. the marking can be rotated by 90 to differentiate assembly location . smb 0.11 g 2500 tape and reel table 6. document revision history date revision changes 20-mar-2012 1 initial release.
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